Partner stand of the International Semiconductor Alliance at PCIM Europe 2024

The International Semiconductor Alliance (ISA) will be presenting state-of-the-art solutions for manufacturing and process optimization in the semiconductor industry at this year’s PCIM 2024 in Nuremberg. ISA members offer a unique combination of technical expertise and comprehensive services covering the entire manufacturing chain from assembly to quality analysis. This knowledge can be used by customers in two recently established application centers in Berlin.

“Our customers can rely on a holistic, comprehensive manufacturing concept that covers all sub-processes in packaging technology, from die attach, housing to inspection and quality analysis,” explains Daniel Schultze, Managing Director of Tresky GmbH. Tresky GmbH is a founding member of ISA alongside budatec GmbH and Nanotest & Design GmbH. Bond Pulse by Dr. Aaron Hutzler is also part of the alliance.

The mission of ISA is to offer cross-process support and consulting services to ensure an efficient, reliable and reproducible manufacturing process. Therefore two application centers have been set up in the north-west and south-east of Berlin to offer customers comprehensive support in process development for prototypes. At the same time, both centers can also be used for production on behalf of customers. “As a contract service provider, we offer our support in the prototyping phase as well as in the production of small series or batch size 1. This enables rapid production on demand. Our customers don’t have to establish their own production capacities or interrupt existing series production,” says Schultze.

Picture: Bonding of a T-Pak using copper sintering paste

“Our engineers support our customers in the implementation of their packaging technologies and partner with them to derive the optimum process selection and parameters for the production of their end products,” continues Schultze. Based on the end product, the production volume and the given cost framework, the ISA member companies develop proposals for process developments as well as structural and process optimizations in order to reduce costs and shorten the time to market. The two application centers also carry out feasibility studies with a final professional evaluation.

Schultze also emphasizes that the application centers are also available to anyone who would like to have process evaluations or a pure process demonstration. ISA offers these individual demonstrations and feasability studies to showcase the performance of the solutions. All common bonding technologies such as adhesive, soldering or sintering can be carried out in the application centers. For subsequent validation, ISA uses appropriate measurement technology such as X-ray, C-SAM or cross-sections. Once the evaluations and feasibility studies have been completed, ISA supports customers and interested parties in the project planning and management of the manufacturing process.

ISA and its member companies will be presenting their product and service portfolio at PCIM Europe in Nuremberg from June 11 – 13 in Hall 5, Stand 402.

International Semiconductor Alliance ISA presents itself for the first time at productronica 2023

It’s better to work together! That’s what the companies Tresky GmbH, budatec GmbH, Berliner Nanotest und Design GmbH and Bond Pulse thought in late summer 2023 and thus founded the International Semiconductor Alliance ISA. The intention is to help customers with the selection, project planning and implementation across all processes and to offer this service from a single source.

“Very often, all four of us noticed that we were not only in contact with the same customers, but were also often involved in the same projects. In order to offer our joint customers even better services, we decided to take the step of working together as closely as possible,” explains Daniel Schultze, Managing Director of Tresky GmbH and one of the initiators of the Alliance.

The ISA founding companies combine a high level of technical expertise. Together, they offer the implementation of all sub-processes in packaging technology. Interested companies can obtain all processes in the manufacturing chain from the members of the ISA from a single source, from bonding, soldering and sintering to inspection and quality analysis. In addition, cross-process support and consulting services are offered for an efficient, reliable and reproducible manufacturing process. “Our customers and interested parties can thus rely on a holistic manufacturing concept that not only massively reduces implementation costs, but also time-to-market,” says Dirk Buße, Managing Director of budatec GmbH. With Dr. Aaron Hutzler, a well-known process specialist in the industry, the Alliance has an expert with cross-process know-how, which is particularly valuable in the evaluation and assessment of work steps.

Various services can be obtained from ISA. “Of course, we advise our customers and pass on our knowledge to them. This involves a holistic evaluation of your assembly and connection technologies. We work with our customers to determine the ideal manufacturing processes and parameters for producing your end products,” explains Dr. Mohamad Abo Ras, managing director of Berlin-based Nanotest und Design GmbH. Based on the end product, the production volume and the specified cost framework, ISA’s specialists draw up recommendations for process developments as well as structural and process optimizations. The evaluations ultimately shorten the time-to-market.

Furthermore, feasibility studies can be carried out in joint application laboratories. These laboratory facilities are also used to produce small series and prototypes on behalf of customers. “One of the most important parts, however, is the management of joint projects. Once we and our customers know how we manufacture their products, we support them in the holistic project planning and design of the manufacturing process. This means they get the manufacturing systems as well as the know-how and processes from a single source, which significantly reduces the overall effort on the customer side,” emphasizes Schultze.

However, the Alliance is not only open to customers and interested parties. “Other companies can also join our Alliance. The productronica trade fair in Munich is a good opportunity to do so, as we can provide interested companies with further information about a possible collaboration,” explains Alexander Dahlbüdding, also Managing Director of budatec GmbH.